型号: 厂商: 批号: 封装: |
型号 | 数量 | 厂商 | 批号 | 封装 | 更新时间 |
---|---|---|---|---|---|
MCP23S17T-E/SO | 3200 | MICROCHIP | 10+ | 18-03-06 | |
MCP23S17-E/SP | 48 | MICROCHIP | 10+ | 18-03-06 | |
MCP23S17-E/SO | 1109 | MICROCHIP | 10+ | 18-03-06 | |
MCP23S09-E/SO | 1 | MICROCHIP | 10+ | 18-03-06 | |
MCP23S09-E/P | 50 | MICROCHIP | 10+ | 18-03-06 | |
MCP23S08T-E/SO | 1100 | MICROCHIP | 10+ | 18-03-06 | |
MCP23S08-E/SS | 2229 | MICROCHIP | 10+ | 18-03-06 | |
TPS76801QPWPR | 6000 | TI | 11+ | SOIC8 | 18-03-06 |
BT169D | 500 | NXP | 11+ | TO92 | 18-03-06 |
LM3886TF | 5000 | NS | 11+ | ZIP | 18-03-06 |
SGM2019-2.5YN5G | 3000 | SG MICRO | 11+ | SOT23-5 | 18-03-06 |
SGM2019-1.2YN5G/TR | 3000 | SG MICRO | 11+ | SOT23-5 | 18-03-06 |
SN74ACT8990FN | 148 | TI | 11+ | PLCC | 18-03-06 |
74VHC541MTCX | 100 | FSC | 10+ | SOP20 | 18-03-06 |
HT1621 | 20 | HOLTEK | 10+ | DIP | 18-03-06 |
HCF40174BE | 20 | ST | 99+ | DIP | 18-03-06 |
24LC256-I/SL | 400 | MICROCHIP | 10+ | SOP | 18-03-06 |
CD74HCT153M | 400 | TI | 09+ | SOP | 18-03-06 |
SGM3157YC5 | 12000 | SG MICRO | 10+ | SOP | 18-03-06 |
LMH6574MA/NOPB | 1384 | NS | 10+ | SOP | 18-03-06 |
SGM2007-1.8XN5 | 6000 | SG MICRO | 10+ | SOT23 | 18-03-06 |
MAX669EUA | 100 | MAXIM | 01+ | SOP | 18-03-06 |
TOP221PN | 10 | PI | 0917+ | DIP8 | 18-03-06 |
AK3225MB24403 | 47 | ANYKA | 0417+ | BGA | 18-03-06 |
BL8506-20CRM | 350 | 上海贝岭 | 08+ | SOT23 | 18-03-06 |
GRM31CR71E106KA12L | 500 | MURATA | 09+ | N/A | 18-03-06 |
LM723CD | 5 | ST | 08+ | SOP | 18-03-06 |
UL2003ADR | 5 | TI | 08+ | SOP | 18-03-06 |
AT24C04 | 94 | ATMEL | 08+ | SOP8 | 18-03-06 |
TA76431FR | 500 | TOSHIBA | 08+ | SOT89 | 18-03-06 |
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